Unified Back Plate (UBP) that is attached under the main board prior to thermal solution

Hi,

My question is regarding Water cooling kitThermal Solution BXTS13X from INTEL

I have started a compain to kill the noise of my Z800. I  am thinking about installing this water cooling kit for XEON socket LGA 1366.

After a few minutes of tchat with Intel, I learnt that the connectivity is not an issue. But reading the manuel in the first page of this water cooling kit I have found this installation note: The processor thermal solution requires a Unified Back Plate (UBP) that is attached under the main board prior to thermal solution mounting. 

I wonder if the motherboard of the Z800 has this backplate.

some technical details regarding my Z800

Motherboard Model 461437-001 - Intel Tylersburg-WS 2S platform, dual Tylersburg IOH, ICH10R controllers, PCIe and PCIe2 slots, and Intel QuickPath Interconnect (QPI) RoHS: COMPLY_2.03 CPU Model Intel Xeon E5645 2.40GHz Hex Core Processor

Thank you for your help.